No. PSO-C17-00002
| Oberthur Card Systems Science And Technology (Shenzhen) Co.,Ltd | |
| 5F, Great Wall Technology Building 3#, | |
| No.2 Kefa Road, Science and Technology Park, | |
| Nanshan District, Shenzhen, P.R.China | |
| William Chang | |
| william-kim-huat.chang@idemia.com | |
| Certification Type & Validity Term | |||
| Product Name | Chip Name and Model | Interface for | TBCC Support |
| UICS RSA V 1.0 | SLE77CLFX2400P | Contact | TBCC Single App. |
| Certification Type & Validity Term | ||
| Valid from | Valid to | Report Ref. |
| 28 Mar 2017 | 28 Mar 2019 | CDCT170I31TP |
No. PSO-C17-00003
| Oberthur Card Systems Science And Technology (Shenzhen) Co.,Ltd | |
| 5F, Great Wall Technology Building 3#, | |
| No.2 Kefa Road, Science and Technology Park, | |
| Nanshan District, Shenzhen, P.R.China | |
| William Chang | |
| william-kim-huat.chang@idemia.com | |
| Certification Type & Validity Term | |||
| Product Name | Chip Name and Model | Interface for | TBCC Support |
| Cosmo Fly V5.8 | SLE77CLFX2407PM/M7794 | Contact&Contactless2 | TBCC Multi App. [TBCC+VISA] |
| Certification Type & Validity Term | ||
| Valid from | Valid to | Report Ref. |
| 5 May 2017 | 5 May 2019 | MDZS170S02TP, LBOBER2422 |
No. PSO-C17-00004
| Oberthur Card Systems Science And Technology (Shenzhen) Co.,Ltd | |
| 5F, Great Wall Technology Building 3#, | |
| No.2 Kefa Road, Science and Technology Park, | |
| Nanshan District, Shenzhen, P.R.China | |
| William Chang | |
| william-kim-huat.chang@idemia.com | |
| Certification Type & Validity Term | |||
| Product Name | Chip Name and Model | Interface for | TBCC Support |
| Cosmo Fly V5.8 | SLE77CLFX2407PM/M7794 | Contact&Contactless2 | TBCC Multi App. [TBCC+MasterCard] |
| Certification Type & Validity Term | ||
| Valid from | Valid to | Report Ref. |
| 15 May 2017 | 15 May 2019 | MDZS170S12TP, CLOA-OBTR151201-160324(a) |
No. PSO-C17-00005
| Oberthur Card Systems Science And Technology (Shenzhen) Co.,Ltd | |
| 5F, Great Wall Technology Building 3#, | |
| No.2 Kefa Road, Science and Technology Park, | |
| Nanshan District, Shenzhen, P.R.China | |
| William Chang | |
| william-kim-huat.chang@idemia.com | |
| Certification Type & Validity Term | |||
| Product Name | Chip Name and Model | Interface for | TBCC Support |
| Cosmo Fly V5.8 | SLE77CLFX2407PM/M7794 | Contact & Contactless | TBCC Multi App. [TBCC+VISA] |
| Certification Type & Validity Term | ||
| Valid from | Valid to | Report Ref. |
| 15 June 2017 | 15 June 2019 | MDZS170S12TP, LBOBER2524 |